In the ever-evolving landscape of engineering education, it is important to understand and invest in the latest technologies to ensure students leave institutions with industry-relevant training and ready for work. Investing in a revolutionary technique to empower students to delve deeper into material behaviour and structural analysis, TecQuipment’s DefleX®, a Digital Image Correlation (DIC) solution, is designed specifically to illuminate the complexities of surface deformations, strains, and displacements in materials and shapes.